Propriedades de tração e de fadiga isotermica de uma junção de cobre com as ligas Sn63-Pb37, Sn62-Pb36-Ag2 e Sn42-Bi58
Eliane Maria Grigoletto
TESE
Português
T/UNICAMP G877p
Campinas, SP : [s.n.], 2003.
147 p. : il.
Orientador: Itamar Ferreira
Tese (doutorado) - Universidade Estadual de Campinas, Faculdade de Engenharia Mecanica
Resumo: As ligas de estanho-chumbo são usadas para soldar componentes eletrônicos sobre placas de circuito impresso. O chumbo e seus compostos são substâncias tóxicas e a indústria eletrônica deverá eliminar este metal do processo de soldagem. A solda, contato permanente entre os componentes e a...
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Resumo: As ligas de estanho-chumbo são usadas para soldar componentes eletrônicos sobre placas de circuito impresso. O chumbo e seus compostos são substâncias tóxicas e a indústria eletrônica deverá eliminar este metal do processo de soldagem. A solda, contato permanente entre os componentes e a placa de circuito impresso, tem como função permitir a passagem de corrente elétrica e fixar os componentes eletrônicos. A resistência a fa1has dos empacotamentos eletrônicos é altamente dependente das propriedades mecânicas e microestrutura da liga de solda usada. As montagens eletrônicas são constantemente sujeitas a flutuações de temperatura devido ao "liga e desliga" dos circuitos ou pelas variações da temperatura ambiente. As diferenças de coeficiente de expansão térmica entre terminais/solda/placa de uma montagem podem produzir tensões e modificações microestruturais na solda. Este trabalho tem por objetivos caracterizar e analisar as propriedades mecânicas e a microestrutura das ligas Sn63-Pb37, Sn62-Pb36-Ag2 e Sn42-Bi58 usadas para soldar dois fios de cobre, topo a topo. As propriedades mecânicas foram analisadas pela rea1ização de ensaios de tração, fadiga isotérmica e microdureza. O método escada foi o usado para calcular a resistência à fadiga das ligas estudas. A caracterização microestrutural das ligas foi efetuada usando as técnicas de microscopia óptica, microscopia eletrônica de varredura e microanálise por EDS. As pastas de solda foram analisadas por termogravimetria (TG) e por calorimetria de varredura diferencial (DSC). O resultado obtido para os ensaios de tração para corpos de cobre sem a junção foi igual a 488 ± 9 MPa. Foi obtida a ordem decrescente de resistência à tração: Sn62-Pb36-Ag2, Sn63-Pb37 e Sn42-Bi58 para as junções de cobre com 0,30mm de espessura. Para a liga Sn63-Pb37, usada para soldar junções de 0,15mm de espessura apresentou o valor de 133 ± 22 MPa de resistência à tração. Os resultados obtidos para a resistência à fadiga isotérmica para as ligas Sn63-Pb37, Sn62-Pb36-Ag2 e Sn42Bi58 para junções de 0,30mm de espessura foram 34 ± 5 MPa, 38± 2MPa e 37± 6 MPa, respectivamente. Para a liga Sn63-Pb37, usada para soldar a junção de cobre de 0,15mm de espessura foi obtido o valor de 28± 5 MPa. Quanto aos ensaios de microdureza, a liga Sn63Pb37 apresentou os valores iguais a 10,1± 9 HV e 7,9:t 0,4 HV para amostras não submetidas ao ensaio de fadiga e submetidas ao ensaio de fadiga, respectivamente. As ligas Sn62-Pb36-Ag2 e Sn42-Bi58 apresentaram os valores de 12,2± 0,9 HV e 15,3± 0,9 HV como resultados dos ensaios de microdureza Vickers. A análise microestrutural das ligas por microscopia óptica e por MEV permitiu a observação das fases e de defeitos presentes em cada liga. No caso da liga SOO3Pb37, foi possível a medida do tamanho das fases ricas em chumbo antes e depois do ensaio de fadiga, sendo os valores obtidos para o comprimento do intercepto médio iguais a 2,3± 0,4mm e 2,8 ± 0,7 mm, respectivamente, sendo que no processo de soldagem usado neste trabalho foi obtida a microestrutura semelhante à encontrada em linhas industriais de montagem. As análises por EDS permitiram a obtenção da composição química das fases de cada liga. As análises por termogravimetria demonstraram que as pastas de solda Sn63-Pb37 e Sn42-Bi58 eliminaram aproximadamente a mesma quantidade de gases voláteis, e que a pasta de Sn62-Pb36-Ag2 foi a que perdeu menos massa. As análises por ca1orimetria de varredura diferencial permitiram constatar que as pastas de solda possuíam a temperatura de fusão encontradas na bibliografia especializada
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Abstract: The tin-lead alloys are used to solder components on printed circuit boards. Lead and its compounds are toxic substances and the electronic industry should substitute this metal in the soldering process. The solder, constant contact between the components and the printed circuit board,...
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Abstract: The tin-lead alloys are used to solder components on printed circuit boards. Lead and its compounds are toxic substances and the electronic industry should substitute this metal in the soldering process. The solder, constant contact between the components and the printed circuit board, should allow the electric current to flow and support the electronic components. The failure resistance of the electronic packaging is bigh1y dependent of mechanical and microstructure properties of the solder alloy used. The electronic assemblies are constantly submitted to temperature fluctuations due to the "on-off" of the circuits or the environmental temperature variations. The coefficient of thermal expansion differences of terminals/solder/printed circuit board present in assemble could produce stress and microstructure modifications in the solder. The objectives of this work are to characterize and ana1yze the mechanical and microstructural properties of Sn63-Pb37, Sn62-Pb36-Ag2 and Sn58-Bi58 alloys used to solder two copper wires in a butt joint. Tension, isotherma1 fatigue, and microhardness tests were conducted in order to characterize the mechanical properties. The staircase method was used to calculate the fatigue strength of the studied alloys. The optical microscopy, scanning electronic microscopy, and microana1ysis by EDS were used to characterize the microstructure of
alloys. The solder pastes were analyzed by thermogravimetry (TG) and scanning differential calorimetry (DSC). The obtained result from the tension tests for the copper specimens without the joint was 488± 9 MPa. The results obtained for the tensile strength for the alloys Sn63-Pb37, Sn62-Pb36-Ag2, and Sn42-Bi58 to the copper joints with O.3Omm of thickness were 93± 8 MPa, 101± 1 MPa, and 79 ± 15 MPa, respectively. The Sn63-Pb37 alloy used to solder 0.15mm thickness joints presented the value equal to 133± 22 MPa to tensile strength. The results obtained to the isotherma1 fatigue strength to the Sn63-Pb37, Sn62-Pb36-Ag2 and Sn42-Bi58 alloys to the joints with 0.30mm of thickness were 34± 5 MPa, 38± 2 MPa and 37± 6 MPa, respectively. To the alloy Sn63-Pb37 used to solder the 0.15mm of thickness of copper joints was obtained the value of 28± 5 MPa. The Sn63-Pb37 presented the values of 10.1± 9HV and 7.9± 0.4 HV for the Vickers microhardness tests of specimens not submitted and submitted to the 1àtigue tests, respectively. The Sn62-Pb37 and Sn42-Bi58 presented the values equals to 12.2± 0.9HV and 15.3 ± 0.9 HV as the results of microhardness tests. The microstructure ana1ysis of the alloy by optical and MEV permitted the observation of the phases and of the defects presents in each alloy. In the case of Sn63-Pb37 it was possible to measure the size of lead rich phases before and after of fatigue test and the values obtained to the medium intercept length was equal to 2.3± 0.4 mm and 2.8± 0.7mm, respectively, and the soldering process used in this work allows to obtain a similar microstructure formed in the industry tine. The EDS ana1ysis permitted to obtain the chemical composition of the phases to each alloy. The ana1yze by thermogravimetry showed that the solder pastes Sn63-Pb37 and Sn42-Bi58 released approximately the same quantity of volatile gases, and the Sn62-Pb36-Ag2 solder paste lost less mass. The scanning differential calorimetry ana1yses showed that the solder pastes had the melting point in accordance with bibliographica1 references Ver menos
alloys. The solder pastes were analyzed by thermogravimetry (TG) and scanning differential calorimetry (DSC). The obtained result from the tension tests for the copper specimens without the joint was 488± 9 MPa. The results obtained for the tensile strength for the alloys Sn63-Pb37, Sn62-Pb36-Ag2, and Sn42-Bi58 to the copper joints with O.3Omm of thickness were 93± 8 MPa, 101± 1 MPa, and 79 ± 15 MPa, respectively. The Sn63-Pb37 alloy used to solder 0.15mm thickness joints presented the value equal to 133± 22 MPa to tensile strength. The results obtained to the isotherma1 fatigue strength to the Sn63-Pb37, Sn62-Pb36-Ag2 and Sn42-Bi58 alloys to the joints with 0.30mm of thickness were 34± 5 MPa, 38± 2 MPa and 37± 6 MPa, respectively. To the alloy Sn63-Pb37 used to solder the 0.15mm of thickness of copper joints was obtained the value of 28± 5 MPa. The Sn63-Pb37 presented the values of 10.1± 9HV and 7.9± 0.4 HV for the Vickers microhardness tests of specimens not submitted and submitted to the 1àtigue tests, respectively. The Sn62-Pb37 and Sn42-Bi58 presented the values equals to 12.2± 0.9HV and 15.3 ± 0.9 HV as the results of microhardness tests. The microstructure ana1ysis of the alloy by optical and MEV permitted the observation of the phases and of the defects presents in each alloy. In the case of Sn63-Pb37 it was possible to measure the size of lead rich phases before and after of fatigue test and the values obtained to the medium intercept length was equal to 2.3± 0.4 mm and 2.8± 0.7mm, respectively, and the soldering process used in this work allows to obtain a similar microstructure formed in the industry tine. The EDS ana1ysis permitted to obtain the chemical composition of the phases to each alloy. The ana1yze by thermogravimetry showed that the solder pastes Sn63-Pb37 and Sn42-Bi58 released approximately the same quantity of volatile gases, and the Sn62-Pb36-Ag2 solder paste lost less mass. The scanning differential calorimetry ana1yses showed that the solder pastes had the melting point in accordance with bibliographica1 references Ver menos
Ferreira, Itamar, 1952-
Orientador
Button, Sérgio Tonini, 1958-
Avaliador
Jorge, Alberto Martins, 1943-2009
Avaliador
Tatsch, Peter Jürgen, 1949-
Avaliador
Propriedades de tração e de fadiga isotermica de uma junção de cobre com as ligas Sn63-Pb37, Sn62-Pb36-Ag2 e Sn42-Bi58
Eliane Maria Grigoletto
Propriedades de tração e de fadiga isotermica de uma junção de cobre com as ligas Sn63-Pb37, Sn62-Pb36-Ag2 e Sn42-Bi58
Eliane Maria Grigoletto
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