Assessing microstructure and mechanical behavior changes in a Sn-Sb solder alloy induced by cooling rate

Assessing microstructure and mechanical behavior changes in a Sn-Sb solder alloy induced by cooling rate

Aline Ferreira Schon, Rodrigo Valenzuela Reyes, José Eduardo Spinelli, Amauri Garcia, Bismarck Luiz Silva

ARTIGO

Inglês

Agradecimentos: The authors are grateful to FAPESP- São Paulo Research Foundation, Brazil (grant 2017/12741-6), Capes- Coordenação de Aperfeiçoamento de Pessoal de Nível Superior, Brazil (Funding Code 001); and CNPq- National Council for Scientific and Technological Development, Brazil (grants...

Abstract: In the present investigation a directional solidification experiment was performed in order to examine distinct microstructures related to different slices of the solidified Sn-2 wt.%Sb alloy casting. Such alloy is an alternative of interest with the target of replacing lead-containing...

CONSELHO NACIONAL DE DESENVOLVIMENTO CIENTÍFICO E TECNOLÓGICO - CNPQ

COORDENAÇÃO DE APERFEIÇOAMENTO DE PESSOAL DE NÍVEL SUPERIOR - CAPES

FUNDAÇÃO DE AMPARO À PESQUISA DO ESTADO DE SÃO PAULO - FAPESP

Fechado

Assessing microstructure and mechanical behavior changes in a Sn-Sb solder alloy induced by cooling rate

Aline Ferreira Schon, Rodrigo Valenzuela Reyes, José Eduardo Spinelli, Amauri Garcia, Bismarck Luiz Silva


										

Assessing microstructure and mechanical behavior changes in a Sn-Sb solder alloy induced by cooling rate

Aline Ferreira Schon, Rodrigo Valenzuela Reyes, José Eduardo Spinelli, Amauri Garcia, Bismarck Luiz Silva

    Fontes

    Journal of alloys and compounds. An interdisciplinary journal of materials science and solid-state chemistry and physics

    Vol. 809 (Nov., 2019), n. art. 151780