The use of a directional solidification technique to investigate the interrelationship of thermal parameters, microstructure and microhardness of Bi–Ag solder alloys

The use of a directional solidification technique to investigate the interrelationship of thermal parameters, microstructure and microhardness of Bi–Ag solder alloys

José Eduardo Spinelli, Bismarck Luiz Silva, Noé Cheung, Amauri Garcia

ARTIGO

Inglês

Agradecimentos: The authors acknowledge the financial support provided by FAPESP (São Paulo Research Foundation: grants 2013/13030-5 and 2013/08259-3) and CNPq (The Brazilian Research Council)

Bi–Ag alloys have been stressed as possible alternatives to replace Pb-based solder alloys. Although acceptable melting temperatures and suitable mechanical properties may characterize such alloys, as referenced in literature, there is a lack of comprehension regarding their microstructures...

CONSELHO NACIONAL DE DESENVOLVIMENTO CIENTÍFICO E TECNOLÓGICO - CNPQ

FUNDAÇÃO DE AMPARO À PESQUISA DO ESTADO DE SÃO PAULO - FAPESP

2013/13030-5; 2013/08259-3

Fechado

The use of a directional solidification technique to investigate the interrelationship of thermal parameters, microstructure and microhardness of Bi–Ag solder alloys

José Eduardo Spinelli, Bismarck Luiz Silva, Noé Cheung, Amauri Garcia

										

The use of a directional solidification technique to investigate the interrelationship of thermal parameters, microstructure and microhardness of Bi–Ag solder alloys

José Eduardo Spinelli, Bismarck Luiz Silva, Noé Cheung, Amauri Garcia

    Fontes

    Materials characterization

    Vol. 96 (Oct., 2014), p. 115-125