Assessment of tertiary dendritic growth and its effects on mechanical properties of directionally solidified sn-0.7cu-xag solder alloys

Assessment of tertiary dendritic growth and its effects on mechanical properties of directionally solidified sn-0.7cu-xag solder alloys

José Eduardo Spinelli, Bismarck Luiz Silva, Amauri Garcia

ARTIGO

Inglês

Although commercial SAC107/207/307 alloys are being used as alternatives to traditional Sn-Pb solder alloys, there is a lack of studies emphasizing some metallurgical aspects, for instance, the different morphologies of Cu6Sn5 and Ag3Sn intermetallic compounds (IMCs) as well as conditions for the...

FUNDAÇÃO DE AMPARO À PESQUISA DO ESTADO DE SÃO PAULO - FAPESP

CONSELHO NACIONAL DE DESENVOLVIMENTO CIENTÍFICO E TECNOLÓGICO - CNPQ

Fechado

Assessment of tertiary dendritic growth and its effects on mechanical properties of directionally solidified sn-0.7cu-xag solder alloys

José Eduardo Spinelli, Bismarck Luiz Silva, Amauri Garcia


										

Assessment of tertiary dendritic growth and its effects on mechanical properties of directionally solidified sn-0.7cu-xag solder alloys

José Eduardo Spinelli, Bismarck Luiz Silva, Amauri Garcia

    Fontes

    Journal of electronic materials

    Vol. 43, no. 5 (May., 2014), p. 1347-1361