Microstructure, phases morphologies and hardness of a Bi–Ag eutectic alloy for high temperature soldering applications

Microstructure, phases morphologies and hardness of a Bi–Ag eutectic alloy for high temperature soldering applications

José Eduardo Spinelli, Bismarck Luiz Silva, Amauri Garcia

ARTIGO

Inglês

The conversion to RoHS-compliant lead-free assembly has been a considerable challenge to the electronics industry. Among several alternative solder alloys, Bi–Ag alloys have been highlighted as a potential candidate to replace high Pb solder alloys for applications in oil and gas, automotive and...

FUNDAÇÃO DE AMPARO À PESQUISA DO ESTADO DE SÃO PAULO - FAPESP

CONSELHO NACIONAL DE DESENVOLVIMENTO CIENTÍFICO E TECNOLÓGICO - CNPQ

Aberto

Microstructure, phases morphologies and hardness of a Bi–Ag eutectic alloy for high temperature soldering applications

José Eduardo Spinelli, Bismarck Luiz Silva, Amauri Garcia


										

Microstructure, phases morphologies and hardness of a Bi–Ag eutectic alloy for high temperature soldering applications

José Eduardo Spinelli, Bismarck Luiz Silva, Amauri Garcia

    Fontes

    Materials & design

    Vol. 58 (June, 2014), p. 482-490