Electrochemical behavior of a lead-free Sn–Cu solder alloy in NaCl solution

Electrochemical behavior of a lead-free Sn–Cu solder alloy in NaCl solution

Wislei R. Osório, Emmanuelle S. Freitas, José E. Spinelli, Amauri Garcia

ARTIGO

Inglês

Agradecimentos: The authors acknowledge the financial support provided by CNPq (The Brazilian Research Council), FAEPEX–UNICAMP and FAPESP (São Paulo Research Foundation – Grant 2013/15478-3)

Electrochemical impedance spectroscopy (EIS), potentiodynamic polarization techniques and an equivalent circuit analysis are used to evaluate the electrochemical corrosion behavior of Sn–Cu alloy samples in a naturally aerated 0.5 M NaCl solution at 25 °C. It has been found that a better...

FUNDAÇÃO DE AMPARO À PESQUISA DO ESTADO DE SÃO PAULO - FAPESP

CONSELHO NACIONAL DE DESENVOLVIMENTO CIENTÍFICO E TECNOLÓGICO - CNPQ

Fechado

Electrochemical behavior of a lead-free Sn–Cu solder alloy in NaCl solution

Wislei R. Osório, Emmanuelle S. Freitas, José E. Spinelli, Amauri Garcia


										

Electrochemical behavior of a lead-free Sn–Cu solder alloy in NaCl solution

Wislei R. Osório, Emmanuelle S. Freitas, José E. Spinelli, Amauri Garcia

    Fontes

    Corrosion science

    Vol. 80 (Mar., 2014), p. 71-81