Electrochemical behavior of a lead-free Sn–Cu solder alloy in NaCl solution
Wislei R. Osório, Emmanuelle S. Freitas, José E. Spinelli, Amauri Garcia
ARTIGO
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Agradecimentos: The authors acknowledge the financial support provided by CNPq (The Brazilian Research Council), FAEPEX–UNICAMP and FAPESP (São Paulo Research Foundation – Grant 2013/15478-3)
Electrochemical impedance spectroscopy (EIS), potentiodynamic polarization techniques and an equivalent circuit analysis are used to evaluate the electrochemical corrosion behavior of Sn–Cu alloy samples in a naturally aerated 0.5 M NaCl solution at 25 °C. It has been found that a better...
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Electrochemical impedance spectroscopy (EIS), potentiodynamic polarization techniques and an equivalent circuit analysis are used to evaluate the electrochemical corrosion behavior of Sn–Cu alloy samples in a naturally aerated 0.5 M NaCl solution at 25 °C. It has been found that a better electrochemical corrosion resistance is provided by a coarser cellular microstructure array. It has also been found that the corrosion current density (icorr) is of about a quarter when compared with that of the finest microstructure examined. Such behavior is attributed to both localized strains between the Sn-rich phase and intermetallic (IMC) particles and the cathode/anode area ratios. The effect of copper alloying on icorr is also discussed
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FUNDAÇÃO DE AMPARO À PESQUISA DO ESTADO DE SÃO PAULO - FAPESP
2013/15478-3
CONSELHO NACIONAL DE DESENVOLVIMENTO CIENTÍFICO E TECNOLÓGICO - CNPQ
Fechado
Electrochemical behavior of a lead-free Sn–Cu solder alloy in NaCl solution
Wislei R. Osório, Emmanuelle S. Freitas, José E. Spinelli, Amauri Garcia
Electrochemical behavior of a lead-free Sn–Cu solder alloy in NaCl solution
Wislei R. Osório, Emmanuelle S. Freitas, José E. Spinelli, Amauri Garcia
Fontes
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Corrosion science Vol. 80 (Mar., 2014), p. 71-81 |