Development of solidification microstructure and tensile mechanical properties of Sn-0.7Cu and Sn-0.7Cu-2.0Ag solders

Development of solidification microstructure and tensile mechanical properties of Sn-0.7Cu and Sn-0.7Cu-2.0Ag solders

José Eduardo Spinelli, Amauri Garcia

ARTIGO

Inglês

Non modified and Ag-modified eutectic Sn-0.7Cu solder alloys were directionally solidified under transient heat flow conditions. The microstructure of the Sn-0.7Cu alloy has been characterized and the present experimental results include the cell/primary dendrite arm spacing (λ1) and its correlation...

FUNDAÇÃO DE AMPARO À PESQUISA DO ESTADO DE SÃO PAULO - FAPESP

CONSELHO NACIONAL DE DESENVOLVIMENTO CIENTÍFICO E TECNOLÓGICO - CNPQ

Fechado

Development of solidification microstructure and tensile mechanical properties of Sn-0.7Cu and Sn-0.7Cu-2.0Ag solders

José Eduardo Spinelli, Amauri Garcia


										

Development of solidification microstructure and tensile mechanical properties of Sn-0.7Cu and Sn-0.7Cu-2.0Ag solders

José Eduardo Spinelli, Amauri Garcia

    Fontes

    Journal of materials science: materials in electronics

    Vol. 25, no. 1 (Jan., 2014), p. 478-486