Microstructural development and mechanical properties of a near-eutectic directionally solidified Sn–Bi solder alloy

Microstructural development and mechanical properties of a near-eutectic directionally solidified Sn–Bi solder alloy

Bismarck Luiz Silva, Guillaume Reinhart, Henri Nguyen-Thi, Nathalie Mangelinck-Noël, Amauri Garcia, José Eduardo Spinelli

ARTIGO

Inglês

Agradecimentos: The authors acknowledge the financial support provided by FAPESP (São Paulo Research Foundation, Brazil: grants 2013/13030-5 and 2013/08259-3), CNPq and CAPES-COFECUB (grant 857/15)

Sn–Bi solders may be applied for electronic applications where low-temperature soldering is required, i.e., sensitive components, step soldering and soldering LEDs. In spite of their potential to cover such applications, the mechanical response of soldered joints of Sn–Bi alloys in some cases does...

CONSELHO NACIONAL DE DESENVOLVIMENTO CIENTÍFICO E TECNOLÓGICO - CNPQ

COORDENAÇÃO DE APERFEIÇOAMENTO DE PESSOAL DE NÍVEL SUPERIOR - CAPES

FUNDAÇÃO DE AMPARO À PESQUISA DO ESTADO DE SÃO PAULO - FAPESP

Fechado

Microstructural development and mechanical properties of a near-eutectic directionally solidified Sn–Bi solder alloy

Bismarck Luiz Silva, Guillaume Reinhart, Henri Nguyen-Thi, Nathalie Mangelinck-Noël, Amauri Garcia, José Eduardo Spinelli


										

Microstructural development and mechanical properties of a near-eutectic directionally solidified Sn–Bi solder alloy

Bismarck Luiz Silva, Guillaume Reinhart, Henri Nguyen-Thi, Nathalie Mangelinck-Noël, Amauri Garcia, José Eduardo Spinelli

    Fontes

    Materials characterization

    Vol. 107 (Sept., 2015), p. 43-53