Interconnection of thermal parameters, microstructure and mechanical properties in directionally solidified Sn–Sb lead-free solder alloys

Interconnection of thermal parameters, microstructure and mechanical properties in directionally solidified Sn–Sb lead-free solder alloys

Marcelino Dias, Thiago Costa, Otávio Rocha, José E. Spinelli, Noé Cheung, Amauri Garcia

ARTIGO

Inglês

Considerable effort is being made to develop lead-free solders for assembling in environmental-conscious electronics, due to the inherent toxicity of Pb. The search for substitute alloys of Pb–Sn solders has increased in order to comply with different soldering purposes. The solder must not only...

FUNDAÇÃO DE AMPARO À PESQUISA DO ESTADO DE SÃO PAULO - FAPESP

CONSELHO NACIONAL DE DESENVOLVIMENTO CIENTÍFICO E TECNOLÓGICO - CNPQ

Fechado

Interconnection of thermal parameters, microstructure and mechanical properties in directionally solidified Sn–Sb lead-free solder alloys

Marcelino Dias, Thiago Costa, Otávio Rocha, José E. Spinelli, Noé Cheung, Amauri Garcia


										

Interconnection of thermal parameters, microstructure and mechanical properties in directionally solidified Sn–Sb lead-free solder alloys

Marcelino Dias, Thiago Costa, Otávio Rocha, José E. Spinelli, Noé Cheung, Amauri Garcia

    Fontes

    Materials characterization

    Vol. 106 (Aug., 2015), p. 52-61