Experimental and numerical analyses of laser remelted Sn–0.7 wt%Cu solder surfaces

Experimental and numerical analyses of laser remelted Sn–0.7 wt%Cu solder surfaces

Bismarck Luiz Silva, José Eduardo Spinelli, Manuel V. Canté, Felipe Bertelli, Noé Cheung, Rudimar Riva, Amauri Garcia

ARTIGO

Inglês

Numerous studies on the effects of solidification thermal parameters, microstructure and reliability of Sn–Cu solder alloys can be found in the literature, however only a very limited number of investigations deal with the application of laser surface remelting (LSR) in soldering processes. One of...

CONSELHO NACIONAL DE DESENVOLVIMENTO CIENTÍFICO E TECNOLÓGICO - CNPQ

FUNDAÇÃO DE AMPARO À PESQUISA DO ESTADO DE SÃO PAULO - FAPESP

Fechado

Experimental and numerical analyses of laser remelted Sn–0.7 wt%Cu solder surfaces

Bismarck Luiz Silva, José Eduardo Spinelli, Manuel V. Canté, Felipe Bertelli, Noé Cheung, Rudimar Riva, Amauri Garcia


										

Experimental and numerical analyses of laser remelted Sn–0.7 wt%Cu solder surfaces

Bismarck Luiz Silva, José Eduardo Spinelli, Manuel V. Canté, Felipe Bertelli, Noé Cheung, Rudimar Riva, Amauri Garcia

    Fontes

    Journal of materials science: materials in electronics

    Vol. 26, no. 5 (May., 2015), p. 3100-3107