Terminal de consulta web

Experimental and numerical analyses of laser remelted Sn–0.7 wt%Cu solder surfaces

Experimental and numerical analyses of laser remelted Sn–0.7 wt%Cu solder surfaces

Bismarck Luiz Silva, José Eduardo Spinelli, Manuel V. Canté, Felipe Bertelli, Noé Cheung, Rudimar Riva, Amauri Garcia

ARTIGO

Inglês

Agradecimentos: The authors acknowledge the financial support provided by FAPESP (São Paulo Research Foundation: Grants 2013/13030-5 and 2012/16328-2) and CNPq (The Brazilian Research Council)

Numerous studies on the effects of solidification thermal parameters, microstructure and reliability of Sn–Cu solder alloys can be found in the literature, however only a very limited number of investigations deal with the application of laser surface remelting (LSR) in soldering processes. One of... Ver mais

CONSELHO NACIONAL DE DESENVOLVIMENTO CIENTÍFICO E TECNOLÓGICO - CNPQ

FUNDAÇÃO DE AMPARO À PESQUISA DO ESTADO DE SÃO PAULO - FAPESP

2013/13030-5; 2012/16328-2

Fechado

Experimental and numerical analyses of laser remelted Sn–0.7 wt%Cu solder surfaces

Bismarck Luiz Silva, José Eduardo Spinelli, Manuel V. Canté, Felipe Bertelli, Noé Cheung, Rudimar Riva, Amauri Garcia

										

Experimental and numerical analyses of laser remelted Sn–0.7 wt%Cu solder surfaces

Bismarck Luiz Silva, José Eduardo Spinelli, Manuel V. Canté, Felipe Bertelli, Noé Cheung, Rudimar Riva, Amauri Garcia

    Fontes

    Journal of materials science: materials in electronics

    Vol. 26, no. 5 (May., 2015), p. 3100-3107