Sn–0.7 wt%Cu–(xNi) alloys : microstructure–mechanical properties correlations with solder/substrate interfacial heat transfer coefficient

Sn–0.7 wt%Cu–(xNi) alloys : microstructure–mechanical properties correlations with solder/substrate interfacial heat transfer coefficient

Bismarck Luiz Silva, Noé Cheung, Amauri Garcia, José Eduardo Spinelli

ARTIGO

Inglês

In spite of being barely studied, the prediction of mechanical properties by controlling and monitoring solidification thermal parameters (growth rate – v; cooling rate – ; solder/substrate interfacial heat transfer coefficient – hi) may be a powerful tool in the pre-programming of optimized final...

CONSELHO NACIONAL DE DESENVOLVIMENTO CIENTÍFICO E TECNOLÓGICO - CNPQ

FUNDAÇÃO DE AMPARO À PESQUISA DO ESTADO DE SÃO PAULO - FAPESP

Fechado

Sn–0.7 wt%Cu–(xNi) alloys : microstructure–mechanical properties correlations with solder/substrate interfacial heat transfer coefficient

Bismarck Luiz Silva, Noé Cheung, Amauri Garcia, José Eduardo Spinelli


										

Sn–0.7 wt%Cu–(xNi) alloys : microstructure–mechanical properties correlations with solder/substrate interfacial heat transfer coefficient

Bismarck Luiz Silva, Noé Cheung, Amauri Garcia, José Eduardo Spinelli

    Fontes

    Journal of alloys and compounds. An interdisciplinary journal of materials science and solid-state chemistry and physics

    Vol. 632 (May., 2015), p. 274-285