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Sn–0.7 wt%Cu–(xNi) alloys : microstructure–mechanical properties correlations with solder/substrate interfacial heat transfer coefficient

Sn–0.7 wt%Cu–(xNi) alloys : microstructure–mechanical properties correlations with solder/substrate interfacial heat transfer coefficient

Bismarck Luiz Silva, Noé Cheung, Amauri Garcia, José Eduardo Spinelli

ARTIGO

Inglês

Agradecimentos: The authors acknowledge the financial support provided by FAPESP, Brazil (São Paulo Research Foundation: grants 2013/08259-3; 2013/13030-5) and CNPq, Brazil

In spite of being barely studied, the prediction of mechanical properties by controlling and monitoring solidification thermal parameters (growth rate – v; cooling rate – ; solder/substrate interfacial heat transfer coefficient – hi) may be a powerful tool in the pre-programming of optimized final... Ver mais

CONSELHO NACIONAL DE DESENVOLVIMENTO CIENTÍFICO E TECNOLÓGICO - CNPQ

FUNDAÇÃO DE AMPARO À PESQUISA DO ESTADO DE SÃO PAULO - FAPESP

2013/08259-3; 2013/13030-5

Fechado

Sn–0.7 wt%Cu–(xNi) alloys : microstructure–mechanical properties correlations with solder/substrate interfacial heat transfer coefficient

Bismarck Luiz Silva, Noé Cheung, Amauri Garcia, José Eduardo Spinelli

										

Sn–0.7 wt%Cu–(xNi) alloys : microstructure–mechanical properties correlations with solder/substrate interfacial heat transfer coefficient

Bismarck Luiz Silva, Noé Cheung, Amauri Garcia, José Eduardo Spinelli

    Fontes

    Journal of alloys and compounds. An interdisciplinary journal of materials science and solid-state chemistry and physics (Fonte avulsa)