Evaluation of solder/substrate thermal conductance and wetting angle of Sn–0.7 wt%Cu–(0–0.1 wt%Ni) solder alloys

Evaluation of solder/substrate thermal conductance and wetting angle of Sn–0.7 wt%Cu–(0–0.1 wt%Ni) solder alloys

Bismarck Luiz Silva, Noé Cheung, Amauri Garcia, José Eduardo Spinelli

ARTIGO

Inglês

Wettability is defined as the tendency of a liquid metal to spread on a solid surface. The solder/substrate thermal conductance represented by a heat transfer coefficient, hi, states the heat ability to flow across the solder/substrate interface during solidification, being affected by the...

CONSELHO NACIONAL DE DESENVOLVIMENTO CIENTÍFICO E TECNOLÓGICO - CNPQ

FUNDAÇÃO DE AMPARO À PESQUISA DO ESTADO DE SÃO PAULO - FAPESP

Fechado

Evaluation of solder/substrate thermal conductance and wetting angle of Sn–0.7 wt%Cu–(0–0.1 wt%Ni) solder alloys

Bismarck Luiz Silva, Noé Cheung, Amauri Garcia, José Eduardo Spinelli


										

Evaluation of solder/substrate thermal conductance and wetting angle of Sn–0.7 wt%Cu–(0–0.1 wt%Ni) solder alloys

Bismarck Luiz Silva, Noé Cheung, Amauri Garcia, José Eduardo Spinelli

    Fontes

    Materials letters

    Vol. 142 (Mar., 2015), p. 163-167