Interrelation of wettability–microstructure–tensile strength of lead-free Sn–Ag and Sn–Bi solder alloys

Interrelation of wettability–microstructure–tensile strength of lead-free Sn–Ag and Sn–Bi solder alloys

Wislei R. Osório, Amauri Garcia

ARTIGO

Inglês

Agradecimentos: The authors acknowledge FAEPEX-UNICAMP, and CNPq (The Brazilian Research Council, Grants 305502/2014-0 and 446797/2014-6)

A comparative investigation on the wettability and tensile strength of a Sn–2Ag, a Sn–40Bi and the traditional eutectic Sn–Pb solder alloys was carried out. The wettability is represented by thickness of covered layer (TCL) and spread area (SA) while the mechanical behaviour by the ultimate tensile...

CONSELHO NACIONAL DE DESENVOLVIMENTO CIENTÍFICO E TECNOLÓGICO - CNPQ

Fechado

Interrelation of wettability–microstructure–tensile strength of lead-free Sn–Ag and Sn–Bi solder alloys

Wislei R. Osório, Amauri Garcia


										

Interrelation of wettability–microstructure–tensile strength of lead-free Sn–Ag and Sn–Bi solder alloys

Wislei R. Osório, Amauri Garcia

    Fontes

    Science and technology of welding and joining

    Vol. 21, no. 6 (Aug., 2016), p. 429-437