Correlation between microstructure and hardness of a Bi-1.5wt%Ag lead-free solder alloy
ARTIGO
Inglês
Agradecimentos: The authors acknowledge the financial support provided by FAPESP (grants 2013/08259-3 and 2013/13030-5) and CNPq
In the present study a hypoeutectic Bi-1.5wt%Ag alloy was directionally solidified under transient heat flow conditions and the microstructure was analysed. Bi-Ag alloys are considered as potential alternatives to replace Pb-based alloys as solder materials for metallic connections under high...
In the present study a hypoeutectic Bi-1.5wt%Ag alloy was directionally solidified under transient heat flow conditions and the microstructure was analysed. Bi-Ag alloys are considered as potential alternatives to replace Pb-based alloys as solder materials for metallic connections under high temperatures. However, a lack of understanding regarding the effects of solidification thermal parameters (growth rate - VL, the cooling rate - dot T) on microstructural aspects is reported in literature. Another challenge is to improve properties and reliability. The results of the present study include the determination of the tip growth rate and the cooling rate by cooling curves recorded by thermocouples positioned along the casting length, metallography, X-ray fluorescence (XRF) and Vickers hardness. The entire directionally solidified Bi-1.5Ag microstructure was arranged by faceted Bi-rich dendrites surrounded by a eutectic mixture (Bi+Ag). The primary and secondary dendrite arm spacing (λ1 and λ2), the interphase spacing (λ) and the diameter of Ag-rich particles were also measured along the casting length; and experimental growth laws. Relating these microstructural features to the experimental thermal parameters are proposed
CONSELHO NACIONAL DE DESENVOLVIMENTO CIENTÍFICO E TECNOLÓGICO - CNPQ
FUNDAÇÃO DE AMPARO À PESQUISA DO ESTADO DE SÃO PAULO - FAPESP
2013/08259-3; 2013/13030-5
Fechado
Correlation between microstructure and hardness of a Bi-1.5wt%Ag lead-free solder alloy
Correlation between microstructure and hardness of a Bi-1.5wt%Ag lead-free solder alloy
Fontes
IOP conference series : materials science and engineering Vol. 117 (Mar., 2016), n. art. 012028 |