Correlation between microstructure and hardness of a Bi-1.5wt%Ag lead-free solder alloy

Correlation between microstructure and hardness of a Bi-1.5wt%Ag lead-free solder alloy

J E Spinelli, R A Maced, B L Silva, A Garcia

ARTIGO

Inglês

In the present study a hypoeutectic Bi-1.5wt%Ag alloy was directionally solidified under transient heat flow conditions and the microstructure was analysed. Bi-Ag alloys are considered as potential alternatives to replace Pb-based alloys as solder materials for metallic connections under high...

CONSELHO NACIONAL DE DESENVOLVIMENTO CIENTÍFICO E TECNOLÓGICO - CNPQ

FUNDAÇÃO DE AMPARO À PESQUISA DO ESTADO DE SÃO PAULO - FAPESP

Fechado

Correlation between microstructure and hardness of a Bi-1.5wt%Ag lead-free solder alloy

J E Spinelli, R A Maced, B L Silva, A Garcia


										

Correlation between microstructure and hardness of a Bi-1.5wt%Ag lead-free solder alloy

J E Spinelli, R A Maced, B L Silva, A Garcia

    Fontes

    IOP conference series : materials science and engineering

    Vol. 117 (Mar., 2016), n. art. 012028