Cooling thermal parameters and microstructure features of directionally solidified ternary Sn–Bi–(Cu,Ag) solder alloys

Cooling thermal parameters and microstructure features of directionally solidified ternary Sn–Bi–(Cu,Ag) solder alloys

Bismarck L. Silva, Amauri Garcia, José E. Spinelli

ARTIGO

Inglês

Agradecimentos: The authors acknowledge the financial support provided by FAPESP (São Paulo Research Foundation, Brazil: grants 2013/08259-3 and 2013/13030-5), CNPq and CAPES-COFECUB (grant 857/15)

Low temperature soldering technology encompasses Sn–Bi based alloys as reference materials for joints since such alloys may be molten at temperatures less than 180 °C. Despite the relatively high strength of these alloys, segregation problems and low ductility are recognized as potential...

FUNDAÇÃO DE AMPARO À PESQUISA DO ESTADO DE SÃO PAULO - FAPESP

CONSELHO NACIONAL DE DESENVOLVIMENTO CIENTÍFICO E TECNOLÓGICO - CNPQ

Fechado

Cooling thermal parameters and microstructure features of directionally solidified ternary Sn–Bi–(Cu,Ag) solder alloys

Bismarck L. Silva, Amauri Garcia, José E. Spinelli


										

Cooling thermal parameters and microstructure features of directionally solidified ternary Sn–Bi–(Cu,Ag) solder alloys

Bismarck L. Silva, Amauri Garcia, José E. Spinelli

    Fontes

    Materials characterization

    Vol. 114 (Apr., 2016), p. 30-42