Solder/substrate interfacial thermal conductance and wetting angles of Bi–Ag solder alloys

Solder/substrate interfacial thermal conductance and wetting angles of Bi–Ag solder alloys

Bismarck Luiz Silva, Felipe Bertelli, Manuel V. Canté, José E. Spinelli, Noé Cheung, Amauri Garcia

ARTIGO

Inglês

Bi–Ag lead-free alloys are considered interesting alternatives to Pb-based traditional solders due to compatible melting point and strength. During soldering, the ability of a liquid alloy to flow or spread over the substrate is crucial for the formation of a metallic bond driven by the...

CONSELHO NACIONAL DE DESENVOLVIMENTO CIENTÍFICO E TECNOLÓGICO - CNPQ

FUNDAÇÃO DE AMPARO À PESQUISA DO ESTADO DE SÃO PAULO - FAPESP

Fechado

Solder/substrate interfacial thermal conductance and wetting angles of Bi–Ag solder alloys

Bismarck Luiz Silva, Felipe Bertelli, Manuel V. Canté, José E. Spinelli, Noé Cheung, Amauri Garcia


										

Solder/substrate interfacial thermal conductance and wetting angles of Bi–Ag solder alloys

Bismarck Luiz Silva, Felipe Bertelli, Manuel V. Canté, José E. Spinelli, Noé Cheung, Amauri Garcia

    Fontes

    Journal of materials science: materials in electronics

    Vol. 27, no. 2 (Feb., 2016), p. 1994-2003