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Cu and Ag additions affecting the solidification microstructure and tensile properties of Sn-Bi lead-free solder alloys

Cu and Ag additions affecting the solidification microstructure and tensile properties of Sn-Bi lead-free solder alloys

Bismarck L. Silva, Marcella G.C. Xavier, Amauri Garcia, José E. Spinelli

ARTIGO

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Agradecimentos: The authors acknowledge the financial support provided by FAPESP (São Paulo Research Foundation, Brazil: grants 2015/11863-5 and 2016/10596-6) and CNPq

Over the past few years Sn-based solders containing third and fourth elements have become of great interest to try and improve the consistency of solders during application. In most reported cases this involved the addition of either Ni in Sn-Cu or Ag in Sn-Bi solder alloys. Still there is a lack of... Ver mais

FUNDAÇÃO DE AMPARO À PESQUISA DO ESTADO DE SÃO PAULO - FAPESP

2015/11863-5; 2016/10596-6

CONSELHO NACIONAL DE DESENVOLVIMENTO CIENTÍFICO E TECNOLÓGICO - CNPQ

Fechado

Cu and Ag additions affecting the solidification microstructure and tensile properties of Sn-Bi lead-free solder alloys

Bismarck L. Silva, Marcella G.C. Xavier, Amauri Garcia, José E. Spinelli

										

Cu and Ag additions affecting the solidification microstructure and tensile properties of Sn-Bi lead-free solder alloys

Bismarck L. Silva, Marcella G.C. Xavier, Amauri Garcia, José E. Spinelli

    Fontes

    Materials science and engineering A: structural materials: properties, microstructures and processing (Fonte avulsa)