Cu and Ag additions affecting the solidification microstructure and tensile properties of Sn-Bi lead-free solder alloys

Cu and Ag additions affecting the solidification microstructure and tensile properties of Sn-Bi lead-free solder alloys

Bismarck L. Silva, Marcella G.C. Xavier, Amauri Garcia, José E. Spinelli

ARTIGO

Inglês

Over the past few years Sn-based solders containing third and fourth elements have become of great interest to try and improve the consistency of solders during application. In most reported cases this involved the addition of either Ni in Sn-Cu or Ag in Sn-Bi solder alloys. Still there is a lack of...

FUNDAÇÃO DE AMPARO À PESQUISA DO ESTADO DE SÃO PAULO - FAPESP

CONSELHO NACIONAL DE DESENVOLVIMENTO CIENTÍFICO E TECNOLÓGICO - CNPQ

Fechado

Cu and Ag additions affecting the solidification microstructure and tensile properties of Sn-Bi lead-free solder alloys

Bismarck L. Silva, Marcella G.C. Xavier, Amauri Garcia, José E. Spinelli


										

Cu and Ag additions affecting the solidification microstructure and tensile properties of Sn-Bi lead-free solder alloys

Bismarck L. Silva, Marcella G.C. Xavier, Amauri Garcia, José E. Spinelli

    Fontes

    Materials science and engineering A: structural materials: properties, microstructures and processing

    Vol. 705 (Sept., 2017), p. 325-334