Directional solidification of a Sn-0.2Ni solder alloy in water-cooled copper and steel molds : related effects on the matrix micromorphology, nature of intermetallics and tensile properties

Directional solidification of a Sn-0.2Ni solder alloy in water-cooled copper and steel molds : related effects on the matrix micromorphology, nature of intermetallics and tensile properties

Marcella G.C. Xavier, Clarissa B. Cruz, Rafael Kakitani, Bismarck L. Silva, Amauri Garcia, Noé Cheung, José E. Spinelli

ARTIGO

Inglês

The present investigation is focused on, firstly, performing transient directional solidification experiments with a Sn-0.2 wt.% Ni solder alloy using two different substrates as mold sheets separating the alloy casting from the cooling fluid: copper and low carbon steel. Secondly, the examination...

FUNDAÇÃO DE AMPARO À PESQUISA DO ESTADO DE SÃO PAULO - FAPESP

CONSELHO NACIONAL DE DESENVOLVIMENTO CIENTÍFICO E TECNOLÓGICO - CNPQ

Fechado

Directional solidification of a Sn-0.2Ni solder alloy in water-cooled copper and steel molds : related effects on the matrix micromorphology, nature of intermetallics and tensile properties

Marcella G.C. Xavier, Clarissa B. Cruz, Rafael Kakitani, Bismarck L. Silva, Amauri Garcia, Noé Cheung, José E. Spinelli


										

Directional solidification of a Sn-0.2Ni solder alloy in water-cooled copper and steel molds : related effects on the matrix micromorphology, nature of intermetallics and tensile properties

Marcella G.C. Xavier, Clarissa B. Cruz, Rafael Kakitani, Bismarck L. Silva, Amauri Garcia, Noé Cheung, José E. Spinelli

    Fontes

    Journal of alloys and compounds. An interdisciplinary journal of materials science and solid-state chemistry and physics

    Vol. 723 (Nov., 2017), p. 1039-1052