Effects of solidification thermal parameters on microstructure and mechanical properties of sn-bi solder alloys

Effects of solidification thermal parameters on microstructure and mechanical properties of sn-bi solder alloys

Bismarck Luiz Silva, Vítor Covre Evangelista da Silva, Amauri Garcia, José Eduardo Spinelli

ARTIGO

Inglês

Samples extracted along the length of directionally solidified (DS) castings of three Sn-xBi alloys (x = 34 wt.%Bi, 52 wt.%Bi and 58 wt.%Bi) were first evaluated metallographically and then subjected to scanning electron microscopy and energy-dispersive x-ray spectroscopy analyses. The...

FUNDAÇÃO DE AMPARO À PESQUISA DO ESTADO DE SÃO PAULO - FAPESP

COORDENAÇÃO DE APERFEIÇOAMENTO DE PESSOAL DE NÍVEL SUPERIOR - CAPES

CONSELHO NACIONAL DE DESENVOLVIMENTO CIENTÍFICO E TECNOLÓGICO - CNPQ

Fechado

Effects of solidification thermal parameters on microstructure and mechanical properties of sn-bi solder alloys

Bismarck Luiz Silva, Vítor Covre Evangelista da Silva, Amauri Garcia, José Eduardo Spinelli


										

Effects of solidification thermal parameters on microstructure and mechanical properties of sn-bi solder alloys

Bismarck Luiz Silva, Vítor Covre Evangelista da Silva, Amauri Garcia, José Eduardo Spinelli

    Fontes

    Journal of electronic materials

    Vol. 46, no. 3 (Mar., 2017), p. 1754-1769