High cooling rate, regular and plate like cells in sn–ni solder alloys
ARTIGO
Inglês
Agradecimentos: The authors thank the financial support provided by FAPESP (São Paulo Research Foundation, Brazil: grants 2015/11863-5; 2016/18186-1; 2016/10596-6; 2017/15158-0), CNPq, and CAPES
Broad ranges of cooling rates (urn:x-wiley:14381656:media:adem201701179:adem201701179-math-0001) 0.8–30.5 and 0.4–5.0 K s−1 are attained during directional solidification of eutectic Sn–0.2 wt% Ni and hypereutectic Sn–0.5 wt% Ni alloys, respectively. A reverse high cooling rate cell‐to‐dendrite...
Broad ranges of cooling rates (urn:x-wiley:14381656:media:adem201701179:adem201701179-math-0001) 0.8–30.5 and 0.4–5.0 K s−1 are attained during directional solidification of eutectic Sn–0.2 wt% Ni and hypereutectic Sn–0.5 wt% Ni alloys, respectively. A reverse high cooling rate cell‐to‐dendrite transition occurs for the eutectic composition and a transition from high cooling rate cells to plate like cells for the hypereutectic alloy. High cooling rate β ‐Sn cells are associated with cooling rates >5.5 and >2.7 K s−1 for eutectic and hypereutectic compositions, respectively. A processing diagram, relating the ‘urn:x-wiley:14381656:media:adem201701179:adem201701179-math-0002–Ni content’ space with the microstructural morphology, is proposed. A combination of plate like cells and plate NiSn4 eutectic phase results in higher ductility
COORDENAÇÃO DE APERFEIÇOAMENTO DE PESSOAL DE NÍVEL SUPERIOR - CAPES
FUNDAÇÃO DE AMPARO À PESQUISA DO ESTADO DE SÃO PAULO - FAPESP
2015/11863-5; 2016/18186-1; 2016/10596-6; 2017/15158-0
CONSELHO NACIONAL DE DESENVOLVIMENTO CIENTÍFICO E TECNOLÓGICO - CNPQ
Fechado
High cooling rate, regular and plate like cells in sn–ni solder alloys
High cooling rate, regular and plate like cells in sn–ni solder alloys
Fontes
Advanced engineering materials Vol. 20, no. 7 (July, 2018), n. art. 1701179 |