High cooling rate, regular and plate like cells in sn–ni solder alloys

High cooling rate, regular and plate like cells in sn–ni solder alloys

Marcella G. C. Xavier, Bismarck L. Silva, Amauri Garcia, José E. Spinelli

ARTIGO

Inglês

Broad ranges of cooling rates (urn:x-wiley:14381656:media:adem201701179:adem201701179-math-0001) 0.8–30.5 and 0.4–5.0 K s−1 are attained during directional solidification of eutectic Sn–0.2 wt% Ni and hypereutectic Sn–0.5 wt% Ni alloys, respectively. A reverse high cooling rate cell‐to‐dendrite...

COORDENAÇÃO DE APERFEIÇOAMENTO DE PESSOAL DE NÍVEL SUPERIOR - CAPES

FUNDAÇÃO DE AMPARO À PESQUISA DO ESTADO DE SÃO PAULO - FAPESP

CONSELHO NACIONAL DE DESENVOLVIMENTO CIENTÍFICO E TECNOLÓGICO - CNPQ

Fechado

High cooling rate, regular and plate like cells in sn–ni solder alloys

Marcella G. C. Xavier, Bismarck L. Silva, Amauri Garcia, José E. Spinelli


										

High cooling rate, regular and plate like cells in sn–ni solder alloys

Marcella G. C. Xavier, Bismarck L. Silva, Amauri Garcia, José E. Spinelli

    Fontes

    Advanced engineering materials

    Vol. 20, no. 7 (July, 2018), n. art. 1701179