Tailoring morphology and size of microstructure and tensile properties of sn-5.5 wt.%sb-1 wt.%(cu,ag) solder alloys

Tailoring morphology and size of microstructure and tensile properties of sn-5.5 wt.%sb-1 wt.%(cu,ag) solder alloys

Marcelino Dias, Thiago A. Costa, Thiago Soares, Bismarck L. Silva, Noé Cheung Cheung, José E. Spinelli, Amauri Garcia

ARTIGO

Inglês

Agradecimentos: The authors acknowledge the financial support provided by FAPESP (São Paulo Research Foundation, Brazil: Grants 2013/09267-0; 2016/18186-1; 2017/15158-0) and CNPq, and are also grateful for the use of laboratory facilities of CNPEM (The Brazilian Center for Research in Energy and...

Transient directional solidification experiments, and further optical and scanning electron microscopy analyses and tensile tests, allowed the dependence of tensile properties on the micromorphology and length scale of the dendritic/cellular matrix of ternary Sn-5.5Sb-1Ag and Sn-5.5Sb-1Cu alloys to...

CONSELHO NACIONAL DE DESENVOLVIMENTO CIENTÍFICO E TECNOLÓGICO - CNPQ

FUNDAÇÃO DE AMPARO À PESQUISA DO ESTADO DE SÃO PAULO - FAPESP

Fechado

Tailoring morphology and size of microstructure and tensile properties of sn-5.5 wt.%sb-1 wt.%(cu,ag) solder alloys

Marcelino Dias, Thiago A. Costa, Thiago Soares, Bismarck L. Silva, Noé Cheung Cheung, José E. Spinelli, Amauri Garcia


										

Tailoring morphology and size of microstructure and tensile properties of sn-5.5 wt.%sb-1 wt.%(cu,ag) solder alloys

Marcelino Dias, Thiago A. Costa, Thiago Soares, Bismarck L. Silva, Noé Cheung Cheung, José E. Spinelli, Amauri Garcia

    Fontes

    Journal of electronic materials

    Vol. 47, no. 2 (Feb, 2018), p. 1647-1657