A comparative analysis of microstructural features, tensile properties and wettability of hypoperitectic and peritectic Sn-Sb solder alloys

A comparative analysis of microstructural features, tensile properties and wettability of hypoperitectic and peritectic Sn-Sb solder alloys

Marcelino Dias, Thiago A. Costa, Bismarck L. Silva, José E. Spinelli, Noé Cheung, Amauri Garcia

ARTIGO

Inglês

Agradecimentos: The authors acknowledge the financial support provided by FAPESP-São Paulo Research Foundation, Brazil (grants 2016/18186-1; 2013/09267-0; 2017/15158-0) and CNPq - The Brazilian Research Council. The authors would like to thank the Brazilian Nanotechnology National Laboratory –...

Sn-Sb alloys are among the current alternatives for the development of alloys for high-temperature lead-free solders. The Sn-Sb alloys having 5.5 wt.% Sb or less are known to have good mechanical properties, and despite the quite low liquidus temperature have been considered adequate in the...

FUNDAÇÃO DE AMPARO À PESQUISA DO ESTADO DE SÃO PAULO - FAPESP

CONSELHO NACIONAL DE DESENVOLVIMENTO CIENTÍFICO E TECNOLÓGICO - CNPQ

Fechado

A comparative analysis of microstructural features, tensile properties and wettability of hypoperitectic and peritectic Sn-Sb solder alloys

Marcelino Dias, Thiago A. Costa, Bismarck L. Silva, José E. Spinelli, Noé Cheung, Amauri Garcia


										

A comparative analysis of microstructural features, tensile properties and wettability of hypoperitectic and peritectic Sn-Sb solder alloys

Marcelino Dias, Thiago A. Costa, Bismarck L. Silva, José E. Spinelli, Noé Cheung, Amauri Garcia

    Fontes

    Microelectronics reliability

    Vol. 81 (Feb., 2018), p. 150-158