Microstructure characterization and tensile properties of directionally solidified Sn-52 wt% Bi-1wt% Sb and Sn-52wt% Bi-2wt% Sb alloys

Microstructure characterization and tensile properties of directionally solidified Sn-52 wt% Bi-1wt% Sb and Sn-52wt% Bi-2wt% Sb alloys

Jeverton Laureano Paixão, Leonardo Fernandes Gomes, Rodrigo Valenzuela Reyes, Amauri Garcia, José Eduardo Spinelli, Bismarck Luiz Silva

ARTIGO

Inglês

Sn-Bi-based Thermal Interface Materials (TIM) are adequate alloys to promote heat dissipation in power electronics. However, despite the necessary thermal connection, mechanical support for different components and substrates are of prime importance in microelectronic devices. In this framework, the...

COORDENAÇÃO DE APERFEIÇOAMENTO DE PESSOAL DE NÍVEL SUPERIOR - CAPES

FUNDAÇÃO DE AMPARO À PESQUISA DO ESTADO DE SÃO PAULO - FAPESP

CONSELHO NACIONAL DE DESENVOLVIMENTO CIENTÍFICO E TECNOLÓGICO - CNPQ

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Microstructure characterization and tensile properties of directionally solidified Sn-52 wt% Bi-1wt% Sb and Sn-52wt% Bi-2wt% Sb alloys

Jeverton Laureano Paixão, Leonardo Fernandes Gomes, Rodrigo Valenzuela Reyes, Amauri Garcia, José Eduardo Spinelli, Bismarck Luiz Silva


										

Microstructure characterization and tensile properties of directionally solidified Sn-52 wt% Bi-1wt% Sb and Sn-52wt% Bi-2wt% Sb alloys

Jeverton Laureano Paixão, Leonardo Fernandes Gomes, Rodrigo Valenzuela Reyes, Amauri Garcia, José Eduardo Spinelli, Bismarck Luiz Silva

    Fontes

    Materials characterization

    Vol. 166 (Aug., 2020), n. art. 110445