Effects of solidification thermal parameters and Bi doping on silicon size, morphology and mechanical properties of Al-15wt.% Si-3.2wt.% Bi and Al-18wt.% Si-3.2wt.% Bi alloys

Effects of solidification thermal parameters and Bi doping on silicon size, morphology and mechanical properties of Al-15wt.% Si-3.2wt.% Bi and Al-18wt.% Si-3.2wt.% Bi alloys

Marcelino Dias, Ricardo Oliveira, Rafael Kakitani, Noé Cheung, Hani Henein, José Eduardo Spinelli, Amauri Garcia

ARTIGO

Inglês

Agradecimentos: The authors are grateful to FAPESP- São Paulo Research Foundation, Brazil (grants 2017/12741-6 and 2018/11791-2), Capes- Coordenação de Aperfeiçoamento de Pessoal de Nível Superior, Brazil (Funding Code 001); and CNPq- National Council for Scientific and Technological Development,...

The use of bismuth (Bi) in aluminum (Al) industries is recognized as prime importance because of possible recycling as alloying element in special applications such as those enhancing machinability. The effects of Bi interaction on solidification progress as well as on the resulting microstructure...

FUNDAÇÃO DE AMPARO À PESQUISA DO ESTADO DE SÃO PAULO - FAPESP

2017/12741-6; 2018/11791-2

COORDENAÇÃO DE APERFEIÇOAMENTO DE PESSOAL DE NÍVEL SUPERIOR - CAPES

001

CONSELHO NACIONAL DE DESENVOLVIMENTO CIENTÍFICO E TECNOLÓGICO - CNPQ

301600/2015-5; 400506/2016-5

Fechado

Effects of solidification thermal parameters and Bi doping on silicon size, morphology and mechanical properties of Al-15wt.% Si-3.2wt.% Bi and Al-18wt.% Si-3.2wt.% Bi alloys

Marcelino Dias, Ricardo Oliveira, Rafael Kakitani, Noé Cheung, Hani Henein, José Eduardo Spinelli, Amauri Garcia

										

Effects of solidification thermal parameters and Bi doping on silicon size, morphology and mechanical properties of Al-15wt.% Si-3.2wt.% Bi and Al-18wt.% Si-3.2wt.% Bi alloys

Marcelino Dias, Ricardo Oliveira, Rafael Kakitani, Noé Cheung, Hani Henein, José Eduardo Spinelli, Amauri Garcia

    Fontes

    Journal of materials research and technology

    Vol. 9, no. 3 (May/June, 2020), p. 3460-3470