Wetting behavior of Sn–Ag–Cu and Sn–Bi–X alloys : insights into factors affecting cooling rate

Wetting behavior of Sn–Ag–Cu and Sn–Bi–X alloys : insights into factors affecting cooling rate

B.L. Silva, A. Garcia, J.E. Spinelli

ARTIGO

Inglês

Based on two experimental approaches: transient directional solidification and drop shape analyses, the measurements of cooling rates and contact angles (θ) of several solders of interest became practical. Three Sn-0.7Cu-(1; 2 and 3Ag) and four Sn-34Bi-(0Cu; 0.1Cu; 0.7Cu; 2Ag) alloys are...

CONSELHO NACIONAL DE DESENVOLVIMENTO CIENTÍFICO E TECNOLÓGICO - CNPQ

FUNDAÇÃO DE AMPARO À PESQUISA DO ESTADO DE SÃO PAULO - FAPESP

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Wetting behavior of Sn–Ag–Cu and Sn–Bi–X alloys : insights into factors affecting cooling rate

B.L. Silva, A. Garcia, J.E. Spinelli


										

Wetting behavior of Sn–Ag–Cu and Sn–Bi–X alloys : insights into factors affecting cooling rate

B.L. Silva, A. Garcia, J.E. Spinelli

    Fontes

    Journal of materials research and technology

    Vol. 8, no. 1 (Jan./Mar., 2019), p. 1581-1586