Wetting behavior of Sn–Ag–Cu and Sn–Bi–X alloys : insights into factors affecting cooling rate
B.L. Silva, A. Garcia, J.E. Spinelli
ARTIGO
Inglês
Agradecimentos: The authors thank the financial support provided by FAPESP (São Paulo Research Foundation, Brazil: grants 2017/15158-0 and 2017/12741-6), CNPq and the Postgraduate Program in Materials Science and Engineering (PPGCEM-UFRN)
Based on two experimental approaches: transient directional solidification and drop shape analyses, the measurements of cooling rates and contact angles (θ) of several solders of interest became practical. Three Sn-0.7Cu-(1; 2 and 3Ag) and four Sn-34Bi-(0Cu; 0.1Cu; 0.7Cu; 2Ag) alloys are...
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Based on two experimental approaches: transient directional solidification and drop shape analyses, the measurements of cooling rates and contact angles (θ) of several solders of interest became practical. Three Sn-0.7Cu-(1; 2 and 3Ag) and four Sn-34Bi-(0Cu; 0.1Cu; 0.7Cu; 2Ag) alloys are investigated to determine their wetting behavior, compare to each other and bring to light their ability (or not) to control the initial cooling rate. In the case of SAC alloys, increase in Ag means decrease in both θ and cooling rate. An opposite correlation between cooling rate and θ is observed when Sn-34Bi and the Sn-34Bi-0.1Cu alloys are compared
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CONSELHO NACIONAL DE DESENVOLVIMENTO CIENTÍFICO E TECNOLÓGICO - CNPQ
FUNDAÇÃO DE AMPARO À PESQUISA DO ESTADO DE SÃO PAULO - FAPESP
2017/15158-0; 2017/12741-6
Fechado
Garcia, Amauri, 1949-
Autor
Wetting behavior of Sn–Ag–Cu and Sn–Bi–X alloys : insights into factors affecting cooling rate
B.L. Silva, A. Garcia, J.E. Spinelli
Wetting behavior of Sn–Ag–Cu and Sn–Bi–X alloys : insights into factors affecting cooling rate
B.L. Silva, A. Garcia, J.E. Spinelli
Fontes
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Journal of materials research and technology Vol. 8, no. 1 (Jan./Mar., 2019), p. 1581-1586 |