Interplay of wettability, interfacial reaction and interfacial thermal conductance in Sn-0.7Cu solder alloy/substrate couples

Interplay of wettability, interfacial reaction and interfacial thermal conductance in Sn-0.7Cu solder alloy/substrate couples

Thiago Soares, Clarissa Cruz, Bismarck Silva, Crystopher Brito, Amauri Garcia, José Eduardo Spinelli, Noé Cheung

ARTIGO

Inglês

Directional solidification experiments coupled with mathematical modelling, drop shape analyses and evaluation of the reaction layers were performed for three different types of joints produced with the Sn-0.7 wt.%Cu solder alloy. The association of such findings allowed understanding the mechanisms...

COORDENAÇÃO DE APERFEIÇOAMENTO DE PESSOAL DE NÍVEL SUPERIOR - CAPES

FUNDAÇÃO DE AMPARO À PESQUISA DO ESTADO DO AMAZONAS - FAPEAM

FUNDAÇÃO DE AMPARO À PESQUISA DO ESTADO DE SÃO PAULO - FAPESP

CONSELHO NACIONAL DE DESENVOLVIMENTO CIENTÍFICO E TECNOLÓGICO

Fechado

Interplay of wettability, interfacial reaction and interfacial thermal conductance in Sn-0.7Cu solder alloy/substrate couples

Thiago Soares, Clarissa Cruz, Bismarck Silva, Crystopher Brito, Amauri Garcia, José Eduardo Spinelli, Noé Cheung


										

Interplay of wettability, interfacial reaction and interfacial thermal conductance in Sn-0.7Cu solder alloy/substrate couples

Thiago Soares, Clarissa Cruz, Bismarck Silva, Crystopher Brito, Amauri Garcia, José Eduardo Spinelli, Noé Cheung

    Fontes

    Journal of electronic materials

    Vol. 49, no. 1 (Jan., 2020), p. 173-187