Agradecimentos: The author(s) disclosed receipt of the following financial support for the research, authorship, and/or publication of this article: This study was funded by FAPESP (São Paulo Research Foundation, Brazil: Grants no 2015/11863-5; 2016/10596-6; 2017/12741-6; 2017/15158-0) and CNPq

The dependences of microstructures on the solidification thermal parameters of Sn-0.5 wt.%Cu, Sn-0.5 wt.%Cu-0.05 wt.%Al, and Sn-0.5 wt.%Cu-0.1 wt.%Al alloys are examined. Ranges of sizes and morphologies of microstructural phases have been quantitatively assessed due to the broad spectra of cooling...

The dependences of microstructures on the solidification thermal parameters of Sn-0.5 wt.%Cu, Sn-0.5 wt.%Cu-0.05 wt.%Al, and Sn-0.5 wt.%Cu-0.1 wt.%Al alloys are examined. Ranges of sizes and morphologies of microstructural phases have been quantitatively assessed due to the broad spectra of cooling rates and thermal gradients associated with the experiments. Various types of growth relations are proposed to represent the microstructural progresses. Al addition does not change either the matrix primary dendritic spacing or the spacing between Cu6Sn5 particles. However, it is shown that the secondary dendrite arm spacing, lambda2, is greatly affected, increasing with the increase in the Al content. Both globular-type and fibrous-type morphologies typify the Cu6Sn5 intermetallics located in interdendritic zones

FUNDAÇÃO DE AMPARO À PESQUISA DO ESTADO DE SÃO PAULO - FAPESP

2015/11863-5; 2016/10596-6; 2017/12741-6; 2017/15158-0

CONSELHO NACIONAL DE DESENVOLVIMENTO CIENTÍFICO E TECNOLÓGICO - CNPQ

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