Dendritic and eutectic growth of Sn-0.5 wt.%Cu solders with low alloying al levels

Dendritic and eutectic growth of Sn-0.5 wt.%Cu solders with low alloying al levels

Thiago Soares Lima, Bismarck Luiz Silva, Amauri Garcia, Noé Cheung, José Eduardo Spinelli

ARTIGO

Inglês

Agradecimentos: The author(s) disclosed receipt of the following financial support for the research, authorship, and/or publication of this article: This study was funded by FAPESP (São Paulo Research Foundation, Brazil: Grants no 2015/11863-5; 2016/10596-6; 2017/12741-6; 2017/15158-0) and CNPq

The dependences of microstructures on the solidification thermal parameters of Sn-0.5 wt.%Cu, Sn-0.5 wt.%Cu-0.05 wt.%Al, and Sn-0.5 wt.%Cu-0.1 wt.%Al alloys are examined. Ranges of sizes and morphologies of microstructural phases have been quantitatively assessed due to the broad spectra of cooling...

FUNDAÇÃO DE AMPARO À PESQUISA DO ESTADO DE SÃO PAULO - FAPESP

CONSELHO NACIONAL DE DESENVOLVIMENTO CIENTÍFICO E TECNOLÓGICO - CNPQ

Fechado

Dendritic and eutectic growth of Sn-0.5 wt.%Cu solders with low alloying al levels

Thiago Soares Lima, Bismarck Luiz Silva, Amauri Garcia, Noé Cheung, José Eduardo Spinelli


										

Dendritic and eutectic growth of Sn-0.5 wt.%Cu solders with low alloying al levels

Thiago Soares Lima, Bismarck Luiz Silva, Amauri Garcia, Noé Cheung, José Eduardo Spinelli

    Fontes

    Proceedings of the institution of mechanical engineers, part L : journal of materials : design and applications

    Vol. 233, no. 9 (Sept., 2019), p. 1733-1737