Sn-0.5Cu(-x)Al solder alloys : microstructure-related aspects and tensile properties responses
Thiago Soares Lima, Guilherme Lisboa de Gouveia, Rudimylla da Silva Septimio, Clarissa Barros da Cruz, Bismarck Luiz Silva, Crystopher Brito, Jose Eduardo Spinelli, Noe Cheung
ARTIGO
Inglês
Agradecimentos: The authors are grateful for the financial support provided by FAPESP (São Paulo Research Foundation, Brazil; Grants 2015/11863-5; 2016/18186-1; 2017/12741-6; CNPq (National Council for Scientific and Technological Development; Grants 407978/2018-6 and 307830/2017-9); FAPEAM...
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Agradecimentos: The authors are grateful for the financial support provided by FAPESP (São Paulo Research Foundation, Brazil; Grants 2015/11863-5; 2016/18186-1; 2017/12741-6; CNPq (National Council for Scientific and Technological Development; Grants 407978/2018-6 and 307830/2017-9); FAPEAM (Amazonas State Research Support Foundation) and the Brazilian Nanotechnology National Laboratory—LNNano for providing the X-ray diffractometer
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In this study, experiments were conducted to analyze the effect of 0.05 and 0.1 wt.% Al additions during the unsteady-state growth of the Sn-0.5wt.%Cu solder alloy. Various as-solidified specimens of each alloy were selected so that tensile tests could also be performed. Microstructural aspects such...
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In this study, experiments were conducted to analyze the effect of 0.05 and 0.1 wt.% Al additions during the unsteady-state growth of the Sn-0.5wt.%Cu solder alloy. Various as-solidified specimens of each alloy were selected so that tensile tests could also be performed. Microstructural aspects such as the dimensions of primary, lambda(1), and secondary, lambda(2), dendritic arrays, and intermetallic compounds (IMCs) morphologies were comparatively assessed for the three tested compositions, that is, Sn-0.5wt.%Cu, Sn-0.5wt.%Cu-0.05wt.%Al, and Sn-0.5wt.%Cu-0.1wt.%Al alloys. Al addition affected neither the primary dendritic spacing nor the types of morphologies identified for the Cu6Sn5 IMC, which was found to be either globular or fibrous regardless of the alloy considered. Secondary dendrite arm spacing was found to be enlarged and the eutectic fraction was reduced with an increase in the Al-content. Tensile properties remained unaffected with the addition of Al, except for the improvement in ductility of up to 40% when compared to the Sn-0.5wt.%Cu alloy without Al trace. A smaller lambda(2) in size was demonstrated to be the prime microstructure parameter associated with the beneficial effect on the strength of the Sn-0.5wt.%Cu(-x)Al alloys
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FUNDAÇÃO DE AMPARO À PESQUISA DO ESTADO DO AMAZONAS - FAPEAM
407978/2018-6; 307830/2017-9
FUNDAÇÃO DE AMPARO À PESQUISA DO ESTADO DE SÃO PAULO - FAPESP
2015/11863-5; 2016/18186-1; 2017/12741-6
CONSELHO NACIONAL DE DESENVOLVIMENTO CIENTÍFICO E TECNOLÓGICO - CNPQ
Aberto
DOI: https://doi.org/10.3390/met9020241
Texto completo: https://www.mdpi.com/2075-4701/9/2/241
Sn-0.5Cu(-x)Al solder alloys : microstructure-related aspects and tensile properties responses
Thiago Soares Lima, Guilherme Lisboa de Gouveia, Rudimylla da Silva Septimio, Clarissa Barros da Cruz, Bismarck Luiz Silva, Crystopher Brito, Jose Eduardo Spinelli, Noe Cheung
Sn-0.5Cu(-x)Al solder alloys : microstructure-related aspects and tensile properties responses
Thiago Soares Lima, Guilherme Lisboa de Gouveia, Rudimylla da Silva Septimio, Clarissa Barros da Cruz, Bismarck Luiz Silva, Crystopher Brito, Jose Eduardo Spinelli, Noe Cheung
Fontes
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Metals Vol. 9, no. 2 (Feb., 2019), n. art. 241 |