Sn-0.5Cu(-x)Al solder alloys : microstructure-related aspects and tensile properties responses

Sn-0.5Cu(-x)Al solder alloys : microstructure-related aspects and tensile properties responses

Thiago Soares Lima, Guilherme Lisboa de Gouveia, Rudimylla da Silva Septimio, Clarissa Barros da Cruz, Bismarck Luiz Silva, Crystopher Brito, Jose Eduardo Spinelli, Noe Cheung

ARTIGO

Inglês

In this study, experiments were conducted to analyze the effect of 0.05 and 0.1 wt.% Al additions during the unsteady-state growth of the Sn-0.5wt.%Cu solder alloy. Various as-solidified specimens of each alloy were selected so that tensile tests could also be performed. Microstructural aspects such...

FUNDAÇÃO DE AMPARO À PESQUISA DO ESTADO DO AMAZONAS - FAPEAM

FUNDAÇÃO DE AMPARO À PESQUISA DO ESTADO DE SÃO PAULO - FAPESP

CONSELHO NACIONAL DE DESENVOLVIMENTO CIENTÍFICO E TECNOLÓGICO - CNPQ

Aberto

Sn-0.5Cu(-x)Al solder alloys : microstructure-related aspects and tensile properties responses

Thiago Soares Lima, Guilherme Lisboa de Gouveia, Rudimylla da Silva Septimio, Clarissa Barros da Cruz, Bismarck Luiz Silva, Crystopher Brito, Jose Eduardo Spinelli, Noe Cheung


										

Sn-0.5Cu(-x)Al solder alloys : microstructure-related aspects and tensile properties responses

Thiago Soares Lima, Guilherme Lisboa de Gouveia, Rudimylla da Silva Septimio, Clarissa Barros da Cruz, Bismarck Luiz Silva, Crystopher Brito, Jose Eduardo Spinelli, Noe Cheung

    Fontes

    Metals

    Vol. 9, no. 2 (Feb., 2019), n. art. 241