Downloads and views - Time Series

Number of downloads and views in the period.

Period:
Total Year Month Day

Item Handle
(eg. 1822/417)
 

Item
Title : The Effects of Microstructure and Ag3Sn and Cu6Sn5 Intermetallics on the Electrochemical Behavior of Sn-Ag and Sn-Cu Solder Alloys
Entry Date : 30-07-2014
Title : The Effects of Microstructure and Ag3Sn and Cu6Sn5 Intermetallics on the Electrochemical Behavior of Sn-Ag and Sn-Cu Solder Alloys
Entry Date : 26-11-2015
Downloads and viewsExport
Year Downloads Views
2016 0.0 3
2017 0.0 5
2018 0.0 5
2019 0.0 7
2020 0.0 1
0.0 21
Downloads and views per year
Downloads by country (top 10)
Views by country (top 10)
Downloads by countryExport
Views by countryExport
Origin Views Perc.(%)
Brazil Brazil 2 25.00
United States United States 1 12.50
China China 1 12.50
N/A N/A 1 12.50
Japan Japan 1 12.50
Republic of Korea Republic of Korea 1 12.50
Malaysia Malaysia 1 12.50
8 100.00