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dc.contributor.CRUESPUniversidade Estadual de Campinaspt_BR
dc.typeArtigo de periódicopt_BR
dc.titleThe Effects of Microstructure and Ag3Sn and Cu6Sn5 Intermetallics on the Electrochemical Behavior of Sn-Ag and Sn-Cu Solder Alloyspt_BR
dc.contributor.authorOsorio, WRpt_BR
dc.contributor.authorPeixoto, LCpt_BR
dc.contributor.authorGarcia, LRpt_BR
dc.contributor.authorGarcia, Apt_BR
dc.contributor.authorSpinelli, JEpt_BR
unicamp.authorOsorio, Wislei R. Univ Estadual Campinas, UNICAMP, Sch Appl Sci FCA, BR-13484350 Limeira, SP, Brazilpt_BR
unicamp.authorOsorio, Wislei R. Peixoto, Leandro C. Garcia, Leonardo R. Garcia, Amauri Univ Estadual Campinas, UNICAMP, Dept Mat Engn, BR-13083970 Campinas, SP, Brazilpt_BR
unicamp.authorSpinelli, Jose E. Univ Fed Sao Carlos, UFSCar, Dept Mat Engn, BR-13565905 Sao Carlos, SP, Brazilpt_BR
dc.subjectsolder alloyspt_BR
dc.subjectmicrostructure arraypt_BR
dc.subject.wosLead-free Solderpt_BR
dc.subject.wosHuman-body Solutionpt_BR
dc.subject.wosCorrosion Behaviorpt_BR
dc.subject.wosNacl Solutionpt_BR
dc.subject.wosCooling Ratept_BR
dc.description.abstractThe aim of this study is to evaluate the electrochemical corrosion behavior of Sn-2 wt.% Ag and Sn-2.8 wt.% Cu solder alloys in a 0.5 M NaCl solution at 25 degrees C as a function of microstructure features and Ag3Sn and Cu6Sn5 intermetallics. Both Sn-Ag and Sn-Cu alloys are becoming interesting lead-free solder alternatives. Microstructure morphologies obtained from a vertical water-cooled unidirectional solidification system under a cooling rate of about 15 degrees C/s are analyzed. Electrochemical impedance spectroscopy (EIS) diagrams, potentiodynamic polarization curves and an equivalent circuit analysis were used to evaluate the electrochemical parameters. It was found that although the relative cost 1.5 times higher for the Sn-2Ag alloy compared to that of the Sn-2.8Cu alloy, its corresponding electrochemical behavior is better in terms of polarization resistance, current density and pitting corrosion. This is shown to be intimately associated with the resulting fine and homogeneously distributed Ag3Sn intermetallic particles in the Sn-rich
dc.relation.ispartofInternational Journal Of Electrochemical Sciencept_BR
dc.relation.ispartofabbreviationInt. J. Electrochem. Sci.pt_BR
dc.publisherElectrochemical Science Grouppt_BR
dc.identifier.citationInternational Journal Of Electrochemical Science. Electrochemical Science Group, v. 7, n. 7, n. 6436, n. 6452, 2012.pt_BR
dc.sourceWeb of Sciencept_BR
dc.description.sponsorshipFundação de Amparo à Pesquisa do Estado de São Paulo (FAPESP)pt_BR
dc.description.sponsorshipConselho Nacional de Desenvolvimento Científico e Tecnológico (CNPq)pt_BR
dc.description.sponsorship1Fundação de Amparo à Pesquisa do Estado de São Paulo (FAPESP)pt_BR
dc.description.sponsorship1Conselho Nacional de Desenvolvimento Científico e Tecnológico (CNPq)pt_BR
dc.description.provenanceMade available in DSpace on 2014-07-30T19:43:58Z (GMT). No. of bitstreams: 0 Previous issue date: 2012en
dc.description.provenanceMade available in DSpace on 2015-11-26T17:51:51Z (GMT). No. of bitstreams: 2 WOS000306399700056.pdf: 793752 bytes, checksum: 73ae75223d27ee63e7827c38699c7fa7 (MD5) WOS000306399700056.pdf.txt: 40807 bytes, checksum: f9d706e46ef1b3ad1b124b13bfbbd8e6 (MD5) Previous issue date: 2012en
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