Please use this identifier to cite or link to this item: http://repositorio.unicamp.br/jspui/handle/REPOSIP/53502
Type: Artigo de periódico
Title: Mechanical properties of Sn-Zn lead-free solder alloys based on the microstructure array
Author: Garcia, LR
Osorio, WR
Peixoto, LC
Garcia, A
Abstract: The aim of this study is to develop a comparative experimental study interrelating mechanical properties, solidification thermal parameters and microstructure characteristics of a hypoeutectic Sn-4 wt.% Zn, a hypereutectic Sn-12 wt.% Zn and a eutectic Sn-9 wt.% Zn solder alloys. A water-cooled vertical upward unidirectional solidification system was used to obtain the samples. It was found that a more homogeneous distribution of the eutectic mixture, which occurs for smaller dendritic spacings in hypoeutectic and hypereutectic alloys, increases the ultimate tensile strength. The resulting microstructure of the eutectic Sn-9 wt.% Zn alloy has induced higher mechanical strength than those of the Sn-4 wt.% Zn and Sn-12 wt.% Zn alloys. It was found that the eutectic alloy experiences a microstructural transition from globular-to-needle-like Zn-rich morphologies which depend on the solidification growth rate. It is also shown that a globular-like Zn-rich morphology provides higher ultimate tensile strength than a needle-like Zn-rich eutectic morphology. (C) 2009 Elsevier Inc. All rights reserved
Subject: Sn-Zn solder alloys
Mechanical properties
Dendrite arm spacing
Globular and needle-like eutectic morphologies
Solidification thermal parameters
Country: EUA
Editor: Elsevier Science Inc
Citation: Materials Characterization. Elsevier Science Inc, v. 61, n. 2, n. 212, n. 220, 2010.
Rights: fechado
Identifier DOI: 10.1016/j.matchar.2009.11.012
Date Issue: 2010
Appears in Collections:Unicamp - Artigos e Outros Documentos

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