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|Type:||Artigo de periódico|
|Title:||Mechanical properties of Sn-Ag lead-free solder alloys based on the dendritic array and Ag3Sn morphology|
|Abstract:||The aim of this experimental investigation is to evaluate the tensile properties of as-cast Sn-Ag alloys as a function of both the resulting secondary dendritic arm spacings and the morphology of the Ag3Sn IMC (intermetallic compound). This comparative experimental investigation was carried out with a view to assess the application of Sn-Ag alloys as alternative solder materials. A directional water-cooled solidification apparatus was used to obtain the as-cast samples. The resulting microstructures, ultimate and yield tensile strengths and elongation of Sn-2 wt.% Ag and Sn-3.5 wt.% Ag alloys were experimentally determined and compared with the corresponding results of the traditional Sn-40 wt.% Pb solder alloy. It was found that the Sn-Ag alloys examined comply with the compromise between compatible mechanical strength and environmental protection. (C) 2013 Elsevier B. V. All rights reserved.|
|Subject:||Sn-Ag solder alloys|
|Editor:||Elsevier Science Sa|
|Citation:||Journal Of Alloys And Compounds. Elsevier Science Sa, v. 562, n. 194, n. 204, 2013.|
|Appears in Collections:||Unicamp - Artigos e Outros Documentos|
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