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dc.contributor.CRUESPUniversidade Estadual de Campinaspt_BR
dc.typeArtigo de periódicopt_BR
dc.titleLow-resistance films of polyimides with impregnated copper sulfidept_BR
dc.contributor.authorRowe, RVApt_BR
dc.contributor.authorKunita, MHpt_BR
dc.contributor.authorPorto, MFpt_BR
dc.contributor.authorMuniz, ECpt_BR
dc.contributor.authorRubira, AFpt_BR
dc.contributor.authorNery, RCpt_BR
dc.contributor.authorRadovanovic, Ept_BR
dc.contributor.authorTaylor, LTpt_BR
dc.contributor.authorNazem, Npt_BR
unicamp.authorUniv Estadual Maringa, Dept Quim, BR-87020900 Maringa, Parana, Brazil Univ Estadual Maringa, Dept Fis, BR-87020900 Maringa, Parana, Brazil UNICAMP, Inst Quim, Campinas, SP, Brazil Virginia Tech, Dept Chem, Blacksburg, VA 24061 USApt_BR
dc.subject.wosSurface Modificationpt_BR
dc.subject.wosModel Compoundspt_BR
dc.subject.wosSilverpt_BR
dc.subject.wosEscapt_BR
dc.subject.wosCuspt_BR
dc.description.abstractSurface modification of polyimides has been used to obtain better interaction with an inorganic material. Copper sulfide incorporation onto the surface of commercial Kapton (R) polyimide showed that treatment with base was necessary for adherence of the copper sulfide to the polymeric matrix. The optimized conditions for composite preparation, obtained by response surface methodology, was pH 1.4 at 80 degreesC for 3.67 h. Using these conditions, we obtained electrical resistance as low as 1.0 ohm for CuS\Kapton (R) composites. These optimized conditions were used to prepare other low-resistance polyimide composites. The resulting composites were analyzed by photoelectron spectroscopy. The presence of S(2p) and Cu(2p) peaks demonstrated the incorporation of copper sulfide onto the polyimide surface. Scanning electron microphotographs and the images from atomic force microscopy showed a homogeneous CuS distribution in all composites.pt
dc.description.noteo TEXTO COMPLETO DESTE ARTIGO, ESTARÁ DISPONÍVEL À PARTIR DE AGOSTO DE 2015.pt
dc.relation.ispartofJournal Of Materials Researchpt_BR
dc.relation.ispartofabbreviationJ. Mater. Res.pt_BR
dc.publisher.cityWarrendalept_BR
dc.publisher.countryEUApt_BR
dc.publisherMaterials Research Societypt_BR
dc.date.issued2001pt_BR
dc.date.monthofcirculationNOVpt_BR
dc.identifier.citationJournal Of Materials Research. Materials Research Society, v. 16, n. 11, n. 3097, n. 3106, 2001.pt_BR
dc.language.isoenpt_BR
dc.description.volume16pt_BR
dc.description.issuenumber11pt_BR
dc.description.firstpage3097pt_BR
dc.description.lastpage3106pt_BR
dc.rightsembargopt_BR
dc.sourceWeb of Sciencept_BR
dc.identifier.issn0884-2914pt_BR
dc.identifier.wosidWOS:000172020600014pt_BR
dc.identifier.doi10.1557/JMR.2001.0427pt_BR
dc.date.available2014-11-16T20:10:22Z
dc.date.available2015-11-26T16:25:07Z-
dc.date.accessioned2014-11-16T20:10:22Z
dc.date.accessioned2015-11-26T16:25:07Z-
dc.description.provenanceMade available in DSpace on 2014-11-16T20:10:22Z (GMT). No. of bitstreams: 1 WOS000172020600014.pdf: 632949 bytes, checksum: f6b860b444f7dbd47f567a02c029b8f9 (MD5) Previous issue date: 2001en
dc.description.provenanceMade available in DSpace on 2015-11-26T16:25:07Z (GMT). No. of bitstreams: 2 WOS000172020600014.pdf: 632949 bytes, checksum: f6b860b444f7dbd47f567a02c029b8f9 (MD5) WOS000172020600014.pdf.txt: 35950 bytes, checksum: bcbe7182461bb004425439fa8f45cbe1 (MD5) Previous issue date: 2001en
dc.identifier.urihttp://www.repositorio.unicamp.br/jspui/handle/REPOSIP/52841pt_BR
dc.identifier.urihttp://www.repositorio.unicamp.br/handle/REPOSIP/52841
dc.identifier.urihttp://repositorio.unicamp.br/jspui/handle/REPOSIP/52841-
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