Please use this identifier to cite or link to this item: http://repositorio.unicamp.br/jspui/handle/REPOSIP/52841
Type: Artigo de periódico
Title: Low-resistance films of polyimides with impregnated copper sulfide
Author: Rowe, RVA
Kunita, MH
Porto, MF
Muniz, EC
Rubira, AF
Nery, RC
Radovanovic, E
Taylor, LT
Nazem, N
Abstract: Surface modification of polyimides has been used to obtain better interaction with an inorganic material. Copper sulfide incorporation onto the surface of commercial Kapton (R) polyimide showed that treatment with base was necessary for adherence of the copper sulfide to the polymeric matrix. The optimized conditions for composite preparation, obtained by response surface methodology, was pH 1.4 at 80 degreesC for 3.67 h. Using these conditions, we obtained electrical resistance as low as 1.0 ohm for CuS\Kapton (R) composites. These optimized conditions were used to prepare other low-resistance polyimide composites. The resulting composites were analyzed by photoelectron spectroscopy. The presence of S(2p) and Cu(2p) peaks demonstrated the incorporation of copper sulfide onto the polyimide surface. Scanning electron microphotographs and the images from atomic force microscopy showed a homogeneous CuS distribution in all composites.
Country: EUA
Editor: Materials Research Society
Citation: Journal Of Materials Research. Materials Research Society, v. 16, n. 11, n. 3097, n. 3106, 2001.
Rights: embargo
Identifier DOI: 10.1557/JMR.2001.0427
Date Issue: 2001
Appears in Collections:Unicamp - Artigos e Outros Documentos

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