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PreviewIssue DateTitleAuthor(s)AdvisorType
2014Plate-like cell growth during directional solidification of a Zn-20wt%Sn high-temperature lead-free solder alloySantos, WLR; Brito, C; Quaresma, JMV; Spinelli, JE; Garcia, A-Artigo de periódico
2014Inter-relation of Microstructural Features and Dry Sliding Wear Behavior of Monotectic Al-Bi and Al-Pb AlloysFreitas, ES; Silva, AP; Spinelli, JE; Casteletti, LC; Garcia, A-Artigo de periódico
2009Inverse segregation during transient directional solidification of an Al-Sn alloy: Numerical and experimental analysisCruz, KS; Ferreira, IL; Spinelli, JE; Cheung, N; Garcia, A-Artigo de periódico
2012Design of mechanical properties of Al-alloys chill castings based on the metal/mold interfacial heat transfer coefficientSpinelli, JE; Cheung, N; Goulart, PR; Quaresma, JMV; Garcia, A-Artigo de periódico
2010Electrochemical corrosion characterization of Al-Ni alloys in a dilute sodium chloride solutionOsorio, WR; Peixoto, LC; Cante, MV; Garcia, A-Artigo de periódico
2012Electrochemical corrosion behavior of gas atomized Al-Ni alloy powdersOsorio, WR; Spinelli, JE; Afonso, CRM; Peixoto, LC; Garcia, A-Artigo de periódico
2013Combined effects of Ag content and cooling rate on microstructure and mechanical behavior of Sn-Ag-Cu soldersPereira, PD; Spinelli, JE; Garcia, A-Artigo de periódico
2011Macrosegregation and microstructure dendritic array affecting the electrochemical behaviour of ternary Al-Cu-Si alloysOsorio, WR; Moutinho, DJ; Peixoto, LC; Ferreira, IL; Garcia, A-Artigo de periódico
2009Thermal parameters and microstructure during transient directional solidification of a monotectic Al-Bi alloySilva, AP; Spinelli, JE; Garcia, A-Artigo de periódico
2012Cellular to dendritic transition during transient solidification of a eutectic Sn-0.7 wt%Cu solder alloyMoura, ITL; Silva, CLM; Cheung, N; Goulart, PR; Garcia, A; Spinelli, JE-Artigo de periódico