Browsing by Author Spinelli, JE

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PreviewIssue DateTitleAuthor(s)AdvisorType
2012Rapid Solidification of an Al-5Ni Alloy Processed by Spray FormingAfonso, CRM; Spinelli, JE; Bolfarini, C; Botta, WJ; Kiminami, CS; Garcia, A-Artigo de periódico
2011Correlation between dendrite arm spacing and microhardness during unsteady-state directional solidification of Al-Ni alloysSilva, BL; Araujo, IJC; Silva, WS; Goulart, PR; Garcia, A; Spinelli, JE-Artigo de periódico
2005Thermosolutal convective effects on dendritic array spacings in downward transient directional solidification of Al-Si alloysSpinelli, JE; Peres, MD; Garcia, A-Artigo de periódico
2014Plate-like cell growth during directional solidification of a Zn-20wt%Sn high-temperature lead-free solder alloySantos, WLR; Brito, C; Quaresma, JMV; Spinelli, JE; Garcia, A-Artigo de periódico
2014Inter-relation of Microstructural Features and Dry Sliding Wear Behavior of Monotectic Al-Bi and Al-Pb AlloysFreitas, ES; Silva, AP; Spinelli, JE; Casteletti, LC; Garcia, A-Artigo de periódico
2013Interrelation of cell spacing, intermetallic compounds and hardness on a directionally solidified Al-1.0Fe-1.0Ni alloyCante, MV; Brito, C; Spinelli, JE; Garcia, A-Artigo de periódico
2009Investigation of intermetallics in hypoeutectic Al-Fe alloys by dissolution of the Al matrixGoulart, PR; Lazarine, VB; Leal, CV; Spinelli, JE; Cheung, N; Garcia, A-Artigo de periódico
2009Inverse segregation during transient directional solidification of an Al-Sn alloy: Numerical and experimental analysisCruz, KS; Ferreira, IL; Spinelli, JE; Cheung, N; Garcia, A-Artigo de periódico
2012Design of mechanical properties of Al-alloys chill castings based on the metal/mold interfacial heat transfer coefficientSpinelli, JE; Cheung, N; Goulart, PR; Quaresma, JMV; Garcia, A-Artigo de periódico
2012Electrochemical corrosion behavior of gas atomized Al-Ni alloy powdersOsorio, WR; Spinelli, JE; Afonso, CRM; Peixoto, LC; Garcia, A-Artigo de periódico
2014Electrochemical behavior of a lead-free Sn-Cu solder alloy in NaCl solutionOsorio, WR; Freitas, ES; Spinelli, JE; Garcia, A-Artigo de periódico
2013Combined effects of Ag content and cooling rate on microstructure and mechanical behavior of Sn-Ag-Cu soldersPereira, PD; Spinelli, JE; Garcia, A-Artigo de periódico
2011On array models theoretical predictions versus measurements for the growth of cells and dendrites in the transient solidification of binary alloysSpinelli, JE; Cheung, N; Garcia, A-Artigo de periódico
2014Development of solidification microstructure and tensile mechanical properties of Sn-0.7Cu and Sn-0.7Cu-2.0Ag soldersSpinelli, JE; Garcia, A-Artigo de periódico
2009Thermal parameters and microstructure during transient directional solidification of a monotectic Al-Bi alloySilva, AP; Spinelli, JE; Garcia, A-Artigo de periódico
2013Thermal Parameters, Microstructure, and Mechanical Properties of Directionally Solidified Sn-0.7 wt.%Cu Solder Alloys Containing 0 ppm to 1000 ppm NiSilva, BL; Cheung, N; Garcia, A; Spinelli, JE-Artigo de periódico
2010Thermal stress analysis of a directionally solidified Al-1 wt%Ni alloy castingPariona, MM; Rugenski, JK; Cante, MV; Spinelli, JE; Garcia, A-Artigo de periódico
2004Influence of melt convection on dendritic spacings of downward unsteady-state directionally solidified Al-Cu alloysSpinelli, JE; Rosa, DA; Ferreira, IL; Garcia, A-Artigo de periódico
2004Influence of melt convection on the columnar to equiaxed transition and microstructure of downward unsteady-state directionally solidified Sn-Pb alloysSpinelli, JE; Ferreira, IL; Garcia, A-Artigo de periódico
2011Evolution of Eutectic Spacing During Unidirectional Solidification of Al-Ni AlloysAraujo, IJC; da Silva, BL; Spinelli, JE; Garcia, A-Artigo de periódico